TAPE
At D&X, we believe in constant evolving. That is why we extended our profile to provide tape-related services.
Tape
D&X brand name Tape is your One-Stop Solution for Precise Semiconductor Manufacturing.
Our Made in Japan’s Tape is a comprehensive line of high-performance tapes designed to meet the demanding needs of the semiconductor manufacturing industry.
Our products offer exceptional features and functionalities, ensuring optimal results in your critical processes.
Back-Grinding Tape
Strong adhesion to prevent water damage, no adhesive residue keeps adherends clean, especially flat to help with grinding, can be used with uneven surfaces (bump wafers).
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Dicing Tape
Strong adhesion to prevent water damage, no adhesive residue keeps adherends clean, especially flat to help with grinding, can be used with uneven surfaces (bump wafers).
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Bumped Tape
Reduced warping for ultra-thin grinding, heat resistance during grinding/polishing, can protect films for long periods and from heat, antistatic properties when peeling, chemical, acid and base resistance, protective function for high bumps.
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