Bonding

D&X specialized in wafer bonding, a sophisticated semiconductor manufacturing process critical for device integration. This process involves joining two wafers or materials to create a single integrated structure. This bonding process is crucial for the fabrication of various advanced devices, such as MEMS and 3D integrated circuits. It can be achieved through various techniques, including thermo-compression bonding, anodic bonding, direct bonding, and adhesive bonding. Our wafer bonding service is marked by our precision and versatility, accommodating wafer sizes from 2inch to 12inch, and thicknesses ranging from 300um to 775um. Additionally we excel in the bonding of two different materials and different diameters, offering a comprehensive solution for diverse semiconductor applications.