D&X specializes in meticulous wafer precision grinding and thinning services, offering unparalleled customization capabilities. Our partners’ state-of-the-art facilities can adeptly handle wafers of varying thickness, tailoring the process to accommodate specific requirements. With precision expertise, we can achieve wafer thicknesses as fine as 5um, ensuring the utmost accuracy and reliability in our services.
These processes are aimed at achieving specific thickness and flatness requirements for semiconductor wafers.
During precision grinding, the material is carefully removed from the wafer's surface with high precision. This process ensures uniformity across the wafer, contributing to the overall consistency of the semiconductor devices. The goal is to achieve a specific thickness and smooth surface finish. Thinning involves reducing the thickness of the wafer. This is often done to create thinner wafers for applications where a slim profile is essential, such as in advanced integrated circuits or MEMS. Thinning is crucial for reducing the thermal mass and enhancing the performance of the devices.
Precision grinding and thinning
Swift Delivery
Small Quantities Welcome
High Quality
OVERALL INTRODUCTION, OUR CAPABILITY
D&X stands as your esteemed partner for bespoke solutions, delivering top-tier processing services encompassing thin film and metallisation, precision grinding and thinning, dicing, lithography, bumping, and bonding. Our commitment to excellence ensures the provision of high-quality services across a diverse range of materials. All tailored to meet your exacting specifications, and at a competitive price point.
