Bumped Tape
Reduced warping for ultra-thin grinding, heat resistance during grinding/polishing, can protect films for long periods and from heat, antistatic properties when peeling, chemical, acid and base resistance, protective function for high bumps. Protecting high bumps from damage during back grinding.
Swift Delivery
Small Quantities Welcome
High Quality
Standard specifications
Item Name | BG/DC | UV/Non-UV | Use | Properties |
DXーLCP290Z | BG | UV | Supports Bump Wafers | Compatible with Bump Wafer |