We are also specializing in advanced bumping services, a crucial step in semiconductor manufacturing. This process is also known as flip chip bumping, is a semiconductor packaging process that involves adding metal bumps to the bonding pads on a wafer for subsequent assembly with other semiconductor devices or packaging substrates.
Our bumping service is highly customizable, tailored to meet the specific requirements of your project. We offer this precision process on both 200mm and 300mm wafers, ensuring compatibility with a broad spectrum of applications.
Bumping
Swift Delivery
Small Quantities Welcome
High Quality
OVERALL INTRODUCTION, OUR CAPABILITY
D&X stands as your esteemed partner for bespoke solutions, delivering top-tier processing services encompassing thin film and metallisation, precision grinding and thinning, dicing, lithography, bumping, and bonding. Our commitment to excellence ensures the provision of high-quality services across a diverse range of materials. All tailored to meet your exacting specifications, and at a competitive price point.
