SOI wafer

Silicon on Insulator (SOI) represents a breakthrough in semiconductor wafer technology, outperforming traditional bulk silicon methods. By introducing a thin insulating layer, typically silicon oxide, between a layer of silicon and the silicon substrate, SOI significantly reduces junction capacitance. This results in dynamic devices that are up to 15 percent faster and consume 20 percent less power compared to conventional bulk complementary metal-oxide semiconductor (CMOS)-based chips.

The impact of SOI extends across diverse industries due to its ability to enhance electronic device efficiency. It finds applications in high-performance computing, telecommunications, automotive, and the Internet of Things (IoT). SOI wafers are integral to advancing cutting-edge technologies, providing remarkable speed and power-saving capabilities.

At D&X, we offer high-quality SOI wafers with different thicknesses for the Device Layer, BOX Layer, and Handle Layer. While our strong production line is geared towards 8-inch wafers, we can also process smaller diameters with customized specifications. Our services are flexible, starting from a minimum quantity of 1 piece, making them suitable for your research projects or during the R&D phase.