テープ
バックグラインディングテープ
Strong adhesion to prevent water damage, no adhesive residue keeps adherends clean, especially flat to help with grinding, can be used with uneven surfaces (bump wafers).
続きを見る ダイシングテープ
Strong adhesion to prevent water damage, no adhesive residue keeps adherends clean, especially flat to help with grinding, can be used with uneven surfaces (bump wafers).
続きを見る バンプテープ
Reduced warping for ultra-thin grinding, heat resistance during grinding/polishing, can protect films for long periods and from heat, antistatic properties when peeling, chemical, acid and base resistance, protective function for high bumps.
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