矽晶圓

從日常生活到科技發展,矽晶圓都是不可或缺的一部分,D&X能夠提供各種規格的產品以滿足不同客戶的要求。
我們提供從到Dummy Grade到Prime Grade的優質晶圓,潔淨度低至15nm,同時也可提供客製化服務以符合客戶的製程需求。
標準規格的產品下單後2-3日內可以出貨,特殊訂製規格一般在4周內可以完成製造並安排出貨。
如果您需要高品質以及特殊定制的矽晶圓,我們誠邀您與我們合作。

迅速交貨

歡迎量訂購

高品質

01. DUMMY WAFER (COINROLL WAFER)

無論是量產製造、設備檢查、研究開發等,Dummy Wafer在確保安全性和驗證數據方面發揮著重要作用,同時亦廣泛應用於輸送檢查和工藝評估。
D&X可提供從1"到18"的各種規格的Dummy Wafer。對於標準規格的產品,我們經常備有在庫,可以提供非常具有競爭力的價格並保證短時間內發貨。

標準規格

Specifications 2” 3” 4” 5” 6” 8” 12”
Diameter (mm) 50.8±0.5 76.0±0.5 100±0.5 125±0.5 150±0.5 200±0.5 300±0.5
Type/Dopant: P/Boron or N/Ph P/Boron or N/Ph P/Boron or N/Ph P/Boron or N/Ph P/Boron or N/Ph P/Boron or N/Ph P/Boron or N/Ph
Thickness (μm) 280±25 380±25 525±25 625±25 625±25/675±25 725±25 775±25
Flat/Notch Flats Flats Flats Flats Flats/Notch Flats/Notch Notch
Surface Finish As-Cut/Lapped/Etched/SSP/DSP As-Cut/Lapped/Etched/SSP/DSP As-Cut/Lapped/Etched/SSP/DSP As-Cut/Lapped/Etched/SSP/DSP As-Cut/Lapped/Etched/SSP/DSP As-Cut/Lapped/Etched/SSP/DSP As-Cut/Lapped/Etched/SSP/DSP

特殊規格

Specifications 8” 12”
Growth Method CZ/MCZ/FZ CZ/MCZ
Diameter (mm) 200±0.5 300±0.5
Thickness (μm) >680/>700/>1000 >800/>1000/>1300
Resistivity (ohm.cm) >1/>3000/>10000/>20000 >1/>1000/>5000/>20000
Flat/Notch Flats/Notch Notch
Surface Finish As-Cut/Lapped/Etched/SSP/DSP As-Cut/Lapped/Etched/SSP/DSP

02. 無塵晶圓

有控管顆粒度的產品通常被稱為無塵晶圓 (Dust-Free Wafer)。
標準包裝為每盒25片,並採用真空密封包裝以提供保護。此類晶圓分為三種等級:測試級(Test Grade)、監控級(Monitor Grade)及優質級(Prime Grade)。

測試級與監控級晶圓主要用於研發及初期量產階段,而優質級晶圓則具備優異的品質、嚴格的微粒控制及良好的平坦度。這些晶圓廣泛應用於半導體製造、微影製程及積體電路(IC)生產。

此外,D&X亦提供浮區法(Float Zone,FZ)矽晶圓,具有高電阻率、低氧含量及高純度等特性。FZ矽晶圓特別適用於功率元件、射頻(RF)應用及先進研究領域。我們亦可依客戶需求提供客製化規格。

測試晶圓規格

Specifications 2inch Test Grade 3inch Test Grade 4inch Test Grade 6inch Test Grade 8inch Test Grade 12inch Test Grade
Diameter 50.8±0.38mm 76.2±0.63mm 100±0.2mm 150±0.2mm 200±0.2mm 300±0.2mm
Growth Method CZ CZ CZ CZ CZ CZ
Orientation <100> <100> <100> <100> <100> <100>
Type/Dopant P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron
Resistivity 1-100 ohm.cm 1-100 ohm.cm 1-100 ohm.cm 1-100 ohm.cm 1-100 Ω/cm 1-100 Ω/cm
Surface Finish Polished/Etched Polished/Etched Polished/Etched Polished/Etched Polished/Etched Polished/Polished
Thickness 279±25μm 381±25μm 525±25μm 625/675±25μm 725±25μm 775±25μm
TTV ≤10um ≤10um ≤10um ≤10μm ≤10μm ≤10μm
BOW/WARP <40μm <40μm <40μm <40μm <40μm <40μm
Particle 0.3μm≤10ea 0.3μm≤10ea 0.3μm≤10ea 0.3μm≤10ea 0.3μm≤10ea 0.3μm≤10ea
Time of Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment

8英吋和12英吋的產品可根據要求訂製不同潔淨度等的客製化規格。

Specifications 300mm@15nm 300mm@26nm 300mm@37nm 300mm@45nm 300mm@65nm 300mm@90nm 300mm@200nm 200mm@200nm 200mm@160nm 200mm@200nm
Diameter 300±0.2mm 300±0.2mm 300±0.2mm 300±0.2mm 300±0.2mm 300±0.2mm 300±0.2mm 200±0.2mm 200±0.2mm 200±0.2mm
Growth Method CZ CZ CZ CZ CZ CZ CZ CZ CZ CZ
Orientation <100> <100> <100> <100> <100> <100> <100> <100> <100> <100>
Type/Dopant P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron
Resistivity 1-100 Ω/cm 1-100 Ω/cm 1-100 Ω/cm 1-100 Ω/cm 1-100 Ω/cm 1-100 Ω/cm 1-100 Ω/cm 1-100 Ω/cm 1-100 Ω/cm 1-100 Ω/cm
Surface Finish Polished/Polished Polished/Polished Polished/Polished Polished/Polished Polished/Polished Polished/Polished Polished/Polished Polished/Etched Polished/Etched Polished/Etched
Thickness 775±5μm 775±5μm 775±5μm 775±5μm 775±5μm 775±5μm 775±5μm 725±5μm 725±5μm 725±5μm
TTV ≤1μm ≤1μm ≤1μm ≤1μm ≤3μm ≤5μm ≤10μm ≤2μm ≤10μm ≤10μm
BOW/WARP <30μm <30μm <30μm <30μm <30μm <40μm <40μm <30μm <40μm <40μm
Particle 0.015μm≤50ea 0.026μm≤100ea 0.037μm≤70ea 0.045μm≤50ea 0.065μm≤50ea 0.09μm≤50ea 0.2μm≤50ea 0.2μm≤30ea 0.16μm≤50ea 0.2μm≤50ea
Lasermark T7/M12 T7/M12 T7/M12 T7/M12 T7/M12 T7/M12 T7/M12 None Laser Scribe None Laser Scribe None Laser Scribe
Others Notch Notch Notch Notch Notch Notch Notch Notch Notch Notch
Time of Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment Immediate Shipment