EN
JA
高度均勻性，減少崩邊，貼合力強，防止膠絲，耐熱性高。
保證半導體切割製造中的穩定性。
晶圓切割膠帶
迅速交貨
歡迎小量訂購
高品質
標準規格
| Item Name | BG/DC | UV/Non-UV | Use | Properties |
| DX-TAD80CN-R | DC | Non-UV | Silicon Wafer | Supports small chips |
| DX-TAD85C-R | DC | UV | Silicon Wafer | Prevents chipping, Supports small chips |
| DX-TAD95C | DC | UV | Silicon Wafer | Transparent, Highly expandable |
| DX-TAD95C-R | DC | UV | Silicon Wafer | Transparent, Highly expandable, RoHS2.0 compliant |
| DXーTAD95C-AS | DC | UV | Silicon Wafer | Transparent, Highly expandable, RoHS2.0 compliant, Antistatic |
| DX-TAU75 | DC | UV | Glass, Ceramic | |
| DXーTAU115 | DC | UV | Glass, Ceramic | |
| DXーTAU125B | DC | UV | Packaging substrates, hard to cut surfaces | Strong adhesive |
| DX-M08P05S | DC | UV | Glass, Si Wafer, SBS, Metal | Low peeling strength after UV |
| DXーTAP100 | DC | UV | Packaging Substrates, Glass | |
| DX-M14P10S | DC | UV | Packaging substrates | Strong adhesive, Prevents chipping |
| DXーTAP165D | DC | UV | Packaging substrates | Strong adhesive, Prevents chipping |
| DXーTAP165EーAS | DC | UV | Package substrates | Strong adhesive, Prevents chipping, Antistatic |
| DXーTAP165 | DC | UV | Packaging Substrates, Glass | |
| DXーTAB165C | DC | UV | Packaging substrates | Prevents chipping, Easily peeled by hand |
| DX-TAB180C | DC | UV | Packaging substrates | Prevents chipping, Good chip peeling by hand |
| DX-TAB180C-A | DC | UV | Packaging substrates | Prevents chipping, Good chip peeling by hand |