Lithography

D&X strives to be at the forefront of lithography services, offering a highly customizable solutions that caters to the unique demands of our clients. Wafer lithography is a fundamental process that involves transferring a predefined pattern onto a wafer’s surface. Our expertise extends across 100mm to 300mm wafers, encompassing both silicon and glass substrates. With precision and innovation, we deliver lithography services tailored to your specific requirements, ensuring exceptional results in the fabrication of intricate patterns and features on semiconductor substrates.

The primary steps in wafer lithography include:
- Photoresist Coating: a thin layer of photosesitive material, called photoresist, is applied to the wafer’s surface.
- Exposure: the wafer is exposed to light through a mask or photomask. The mask contains the pattern that needs to be transferred onto the wafer.
- Developing: the exposed wafer undergoes a developing process that removes the exposed and unexposed parts of the photoresist, leaving a patterned photoresist layer.
- Etching or Implantation: the exposed areas of the wafer, now revealed by the patterned photoresist, undergo further processes like etching or ion implantation to modify the wafer’s properties.
- Photoresist removal: the remaining photoresist is typically removed, leaving the desired pattern on the wafer.

This lithographic process allows for the mass production of intricate semiconductor devices.