EN
JA
強力的貼合力，可防止滲水，不會留下殘膠，並保持黏合表面清潔。
由於其平整度高，特別適用於研磨操作，可用於凹凸不平的表面（包括凸晶晶圓）。
保護晶片在研磨過程中免受滲水損害。
晶圓研磨膠帶
迅速交貨
歡迎小量訂購
高品質
標準規格
| Item Name | BG/DC | UV/Non-UV | Use | Properties |
| DXーLCP175 | BG | UV | BG standard compatibile | Accuracy, easy to peel |
| DXーLCP180K | BG | UV | BG standard compatibile | High tape thickness, accuracy, easy to peel even for thin film products thanks to UV peeling process |
| DX-LCP130GX | BG | UV | BG standard compatible | Reasonably high tape thickness accuracy, relatively easy to peel even for thin film products thanks to UV peeling process |
| DXーLCP130GNX | BG | NonーUV | BG standard compatibile | General purpose use |
| DXーLCP180LNX | BG | NonーUV | BG standard compatibile | High tape thickness, accuracy、Increased adhesive strength |
| DXーLCP200LNX | BG | NonーUV | BG standard compatibile | High tape thickness |
| DXーLCP290Z | BG | UV | Supports Bump Wafers | Compatible with Bump Wafer |