Dicing

Our advanced wafer dicing service is characterized by precision and flexibility. Our capacity for customized wafer dicing stands as a testament to our commitment to meeting unique client specifications. Furthermore, we offer a diverse range of packaging options, ensuring the seamless delivery of dies in configurations tailored to your specific needs.

Wafer dicing is a semiconductor manufacturing process where a semiconductor wafer is cut or diced into individual pieces, known as dies. These dies contain the individual integrated circuits or other semiconductor components. The dicing process is a crucial step in the production of semiconductor devices, facilitating the separation of multiple devices fabricated on a single wafer intro discrete units. The primary steps of the wafer dicing include
- Alignment: the wafer is aligned to ensure accurate positioning for the dicing process.
- Dicing Blade: a dicing blade, typically a diamond blade, is used to cut through the wafer along predefined scribe lines. These scribe lines were often created during earlier processing steps.
- Separation of Dies: as the blade cuts through the wafer, it separates it into individual dies.
- Pick and Place: after dicing, each die is typically picked up by a tool and placed onto a substrate for further packaging.

Wafer dicing is critical for creating discrete semiconductor components that can be used in various electronic devices. The size and precision of the dicing process are essential factors in the overall efficiency and performance of the semiconductor devices.