PROCESSING SERVICES

D&X specialized in wafer bonding, a sophisticated semiconductor manufacturing process critical for device integration. This process involves joining two wafers or materials to create a single integrated structure.

We are also specializing in advanced bumping services, a crucial step in semiconductor manufacturing. This process is also known as flip chip bumping, is a semiconductor packaging process that involves adding metal bumps to the bonding pads on a wafer for subsequent assembly with other semiconductor devices or packaging substrates.

D&X strives to be at the forefront of lithography services, offering a highly customizable solutions that caters to the unique demands of our clients. Wafer lithography is a fundamental process that involves transferring a predefined pattern onto a wafer’s surface.

Our advanced wafer dicing service is characterized by precision and flexibility. Our capacity for customized wafer dicing stands as a testament to our commitment to meeting unique client specifications.

D&X specializes in meticulous wafer precision grinding and thinning services, offering unparalleled customization capabilities. Our partners’ state-of-the-art facilities can adeptly handle wafers of varying thickness, tailoring the process to accommodate specific requirements.

D&X stands as your esteemed partner for bespoke solutions, delivering top-tier processing services encompassing thin film and metallisation, precision grinding and thinning, dicing, lithography, bumping, and bonding.