- About us
- Products & Services
- Silicon wafer
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Bare Silicon Wafers
Silicon wafers are integral to technological advancement, and our company excels in delivering a wide array tailored to diverse specifications.
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SOI wafer
Silicon on Insulator (SOI) represents a breakthrough in semiconductor wafer technology, outperforming traditional bulk silicon methods.
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Compound Semiconductor
At D&X, with a focus on Silicon Carbide wafers, goes beyond supplying compound materials.
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- Tape
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Back-Grinding Tape
Strong adhesion to prevent water damage, no adhesive residue keeps adherends clean, especially flat to help with grinding, can be used with uneven surfaces (bump wafers).
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Dicing Tape
Strong adhesion to prevent water damage, no adhesive residue keeps adherends clean, especially flat to help with grinding, can be used with uneven surfaces (bump wafers).
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Bumped Tape
Reduced warping for ultra-thin grinding, heat resistance during grinding/polishing, can protect films for long periods and from heat, antistatic properties when peeling, chemical, acid and base resistance, protective function for high bumps.
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- Other materials and products
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Quartz Wafer
Quartz wafers are made from a type of crystalline silicon dioxide (SiO2). These wafers serve as a crucial material in various high-tech industries due to quartz's unique properties.
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Glass Wafer
Glass wafers share similarities with silicon wafers in terms of shape and function, acting as a base for depositing and processing different materials and structures.
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Sapphire
Sapphire wafers are made from crystalline sapphire, which is a form of aluminum oxide (Al2O3).
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Solar Wafer
Solar wafers are the fundamental building blocks of solar cells, which are the key components in solar panels used to generate electricity from sunlight.
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- Processing services
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Thin, film, Metal, Film other
D&X stands as your esteemed partner for bespoke solutions, delivering top-tier processing services encompassing thin film and metallisation, precision grinding and thinning, dicing, lithography, bumping, and bonding.
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Precision grinding and thinning
D&X specializes in meticulous wafer precision grinding and thinning services, offering unparalleled customization capabilities. Our partners’ state-of-the-art facilities can adeptly handle wafers of varying thickness, tailoring the process to accommodate specific requirements.
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Dicing
Our advanced wafer dicing service is characterized by precision and flexibility. Our capacity for customized wafer dicing stands as a testament to our commitment to meeting unique client specifications.
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Lithography
D&X strives to be at the forefront of lithography services, offering a highly customizable solutions that caters to the unique demands of our clients. Wafer lithography is a fundamental process that involves transferring a predefined pattern onto a wafer’s surface.
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Bumping
We are also specializing in advanced bumping services, a crucial step in semiconductor manufacturing. This process is also known as flip chip bumping, is a semiconductor packaging process that involves adding metal bumps to the bonding pads on a wafer for subsequent assembly with other semiconductor devices or packaging substrates.
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Bonding
D&X specialized in wafer bonding, a sophisticated semiconductor manufacturing process critical for device integration. This process involves joining two wafers or materials to create a single integrated structure.
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- Silicon wafer
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