Products & Services

By choosing D&X, you can rest assured that you are partnering with a company that is passionate about the semiconductor industry and dedicated to driving its progress. When it comes to wafers, we provide the highest quality service with overall flexibility. If you are looking for wafer dicing, grinding, thinning, bonding services, you have come to the right place. Contact us today to discuss your specific requirements and experience the D&X difference.

D&X brand name Tape is your One-Stop Solution for Precise Semiconductor Manufacturing. Our Made in Japan's Tape is a comprehensive line of high-performance tapes designed to meet the demanding needs of the semiconductor manufacturing industry. Our products offer exceptional features and functionalities, ensuring optimal results in your critical processes.

D&X stands by a commitment to innovation and flexibility. Beyond tapes and wafers, we extend our offerings to a range of semiconductor materials, ensuring a tailored solution for every need. Whether you require glass wafers, quartz wafers, sapphire, or solar wafers, we are delighted to offer our services. Trust us to deliver excellence in every aspect of your semiconductor material requirements and wafer carrier needs.

Thinning, dicing, polishing, or coating—our processing solutions meet all your semiconductor project needs, ensuring precision and efficiency at every step with a short lead time.