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1-1-4 Nagaoka, Mizuho, Nishitama-gun, Tokyo 190-1232
042-557-2227
042-557-2228
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Home
About us
Products & Services
Silicon wafer
Bare Silicon Wafers
SOI wafer
Compound Semiconductor
Tape
Back-Grinding Tape
Dicing Tape
Bumped Tape
Other materials and products
Quartz Wafer
Glass Wafer
Sapphire
Solar Wafer
Processing services
Thin, Film, Metal, Film other
Precision grinding and thinning
Dicing
Lithography
Bumping
Bonding
Stocklist
Blog
Recruit
Contact